The consolidation of operations has significantly impacted the supply versus demand scenario. The increased production requirements have identified and developed a comprehensive roadmap for cycle time improvements. Every team does a short assessment to see the focused cross-functional development of the wafer. The team members have extensive experience in semiconductor manufacturing to systematically analyze measure, define, improve, and control the wafer stage and performance. The initial assessment is done to increase overall wafer Fab production to record levels. Various approaches are used to eliminate, manage, and sustain the change systematically.

In the semiconductor environment, sensitive and proprietary nature is on focus to make the methodology clear. The applications and normalized performance indicators highlight the improvements needed and solutions developed to achieve the desired results.

The production capacity is changed according to market demand and for forecasting the increase in the number of the wafer for driving or escalating Lithography output completely dependent on the product mix. The demand requirements are changed according to the cycle times to meet the scheduling and commitment dates.

Recent developments of integrated circuits are judged on overall performance and are about 10,000 times better compared to similar devices developed in the past years.

Latest Developments

Recent graphene-based IC is made considering the wafer front end for better performance. The wafer stage may face several problems on the underway to address specific issues for planning forecasted between increases expected from current projects and the steps needed to meet ramp plans. Many processes are used to benefit the external resources for getting proper expertise focusing on the right problems, to develop and implement solutions timely.

The first step is analyzing thoroughly to know the scope to achieve results in an acceptable time. The short on-site assessment of the wafer fabrication operations gives an idea of the current capacity and Photo area for the major areas used in dry etches, diffusion, ion implant, deposition, and wet etch. The Photo area at every station is also used to know the operational inefficiencies disturbing various processes like impeding scheduling, staging, staffing, etc.

The Photo area constrains the capacity of the output and cycle time to relatively small size, integrating the staffing between all areas, to address various underway issues with additional capacity. Therefore, every method is used to challenge the additional capacity to meet the demand targets in the early stages.

Weekly meeting to review progress, activities, plans, is done to keep a continuous eye on the progress. Engineering leaders assess the project activities thoroughly to make needed decisions and focus on the timely implementation of solutions throughout the project.

Published by Michal Federed